BGA Rework

The BGA Rework Course is a comprehensive, 2-day, operator level course that encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies.

Description

The BEST BGA Rework Course addresses the growing popularity of BGA and CBGA packaging in the PCB industry. While these technologies offer advantages like improved first-time yields and reliability, the cost of rework per component has risen significantly due to equipment, training, and the risk of damage, especially with lead-free solder alloys. 

 

BEST's two-day course serves as an introduction to BGA Rework Systems and Processes. Students gain familiarity with the equipment's basic operations and functions. The course provides comprehensive training in reworking electronic printed circuit boards, focusing on PBGA and CBGA technologies. Topics covered include component identification, terminology, re-balling techniques, pasting, placement, reflowing, and hands-on soldering/desoldering techniques using advanced workstations. The curriculum aligns with IPC-A-610, IPC-7711, and IPC-7721 standards. This course is primarily hands-on and designed for beginning soldering technicians, with a focus on demonstrating soldering skills. 

 

Topics Covered 

  • PBGA and CBGA Component Identification 

  • Reballing Techniques using EZReball™ 

  • Desoldering Techniques 

  • Site Prep 

  • Pasting using StencilQuik™ 

  • Component Placing 

  • Reflowing 

  • Plenty of Hands-on Removal and Replacement 

Pre-requisites

None required

Skill Level

Moderate to Advanced

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