Rework of Leadless Devices

The leadless device rework course is comprehensive and employs the skills necessary to perform rework of electronic printed circuit boards that include BTC, LGA, LCC and other leadless device package types. This primarily hands-on course is appropriate for intermediate to advanced skill levels.

Description

The Leadless Device Rework Certification addresses the growing popularity of leadless devices like QFNs, LGAs, and LCCs in the electronics industry. These compact devices offer excellent heat dissipation but pose challenges for rework due to their small size. BEST's comprehensive course equips individuals with the skills needed to rework electronic printed circuit boards containing leadless device package types, including QFN, LGA, LCC, and others. The course covers component identification, terminology, re-bumping techniques, pasting, placing, reflowing, and hands-on soldering/desoldering using modern workstations. It adheres to IPC-A-610, IPC-7711, and IPC-7721 standards. This 1-day course is primarily hands-on and is designed for intermediate-level soldering technicians looking to enhance their skills. Students will demonstrate their soldering abilities. 

Topics Covered: 

  • SRT Summit 1500 Hot Gas Rework Machine 

  • X-ray Inspection Station 

  • Endoscope 

  • Leadless Component Identification 

  • Rebumping Technique using StencilMate™ 

  • Desoldering Techniques 

  • Site Prep 

  • Component Placement 

  • Reflowing 

  • Hands-on Removal and Replacement 

  • Inspection using x-ray

Pre-requisites

None required, Soldering 101 recommended

Skill Level

Moderate

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