SMT Bootcamp

This is a two-day course offering a comprehensive overview of PCB manufacturing and training processes. This course will focus on both through-hole and surface mount technologies (SMT).

Description

The SMT Assembly "Boot Camp" Class is a two-day course offering a comprehensive overview of PCB manufacturing and training processes, focusing on both through-hole and surface mount technologies (SMT). Taught by a team of experienced engineers and technicians with diverse backgrounds in electronics PCB manufacturing, this course provides students with insights into the processes, tools, and materials used in modern electronic assembly. 

What sets this class apart is its practical approach, allowing students to observe different stages of the SMT assembly process and gain real-world experience from various perspectives and company locations. This course includes lectures and practical observations, offering students a foundational understanding of PCB assembly.

Topics Covered: 

  • PCB Board Fabrication 

  • Solder Paste Basics 

  • Stencil Design 

  • Printing parameters 

  • Component Placement 

  • Overview of the placement process - SMT Tour 

  • Analysis of the reflow process and profiling 

  • Wave Soldering 

  • Cleaning and cleanliness testing 

  • Testing 

  • Component ID 

  • PCB fab process and tour 

  • Stencil fab tour 

  • Printing demonstration 

  • Solder paste printing and placement demo 

  • X-Ray equipment demo 

  • Tour of testing facility ICT and flying probe 

  • Testing and certification 

Pre-requisites

None required

Skill Level

Moderate

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